Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device

ABSTRACT

According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/463,580, filed on May 3, 2012, which is based upon and claims thebenefit of priority from Japanese Patent Application No. 2011-218615,filed on Sep. 30, 2011, the entire contents of which are incorporatedherein by reference.

FIELD

Embodiments described herein relate generally to an apparatus formanufacturing a flexible printed wiring board, an apparatus formanufacturing a wiring board, and an applying device.

BACKGROUND

Conventionally, there has been known a flexible printed wiring board inwhich conductor patterns are formed on both sides of a base layer (innerlayer) constituted of an insulator, and each conductor pattern iscovered with an outer layer constituted of an insulator.

In manufacturing a wiring board such as the flexible printed wiringboard, a manufacturing apparatus capable of easily manufacturing thewiring board having less inconvenience has been desired.

BRIEF DESCRIPTION OF THE DRAWINGS

A general architecture that implements the various features of theinvention will now be described with reference to the drawings. Thedrawings and the associated descriptions are provided to illustrateembodiments of the invention and not to limit the scope of theinvention.

FIG. 1 is an exemplary front view of a television receiver according toa first embodiment;

FIG. 2 is an exemplary cross sectional view schematically illustrating aprinted wiring board in the first embodiment;

FIG. 3 is an exemplary cross sectional view schematically illustrating aprinted wiring board according to a second embodiment;

FIG. 4 is an exemplary plan view schematically illustrating a printedwiring board according to a third embodiment;

FIG. 5 is an exemplary perspective view of an electronic deviceaccording to a fourth embodiment;

FIG. 6 is an exemplary bottom view of inside the electronic deviceillustrated in FIG. 5, in the fourth embodiment;

FIG. 7 is an exemplary cross sectional view of a flexible printed wiringboard illustrated in FIG. 6, in the fourth embodiment;

FIG. 8 is an exemplary flowchart of a method for manufacturing a wiringboard in one embodiment;

FIG. 9 is an exemplary plan view of a structure of the wiring boardmanufactured at S1 of the method for manufacturing the wiring board inFIG. 8, in the one embodiment;

FIG. 10 is an exemplary cross sectional view taken along a line X-X inFIG. 9, in the one embodiment;

FIG. 11 is an exemplary plan view of the structure of the wiring boardmanufactured at S2 of the method for manufacturing the wiring board inFIG. 8, in the one embodiment;

FIG. 12 is an exemplary cross sectional view taken along a line XII-XIIin FIG. 11, in the one embodiment;

FIG. 13 is an exemplary cross sectional view of the structure of thewiring board manufactured at S3 of the method for manufacturing thewiring board in FIG. 8, in the one embodiment;

FIG. 14 is an exemplary cross sectional view of the structure of thewiring board manufactured at S4 of the method for manufacturing thewiring board in FIG. 8, in the one embodiment;

FIG. 15 is an exemplary plan view of the structure of the wiring boardmanufactured at S5 of the method for manufacturing the wiring board inFIG. 8, in the one embodiment;

FIG. 16 is an exemplary plan view of the wiring board manufactured bythe method for manufacturing the wiring board in FIG. 8, in the oneembodiment;

FIG. 17 is an exemplary cross sectional view taken along a lineXVII-XVII in FIG. 16, in the one embodiment;

FIG. 18 is an exemplary plan view schematically illustrating a generalconfiguration of an apparatus for manufacturing a wiring board accordingto a fifth embodiment;

FIG. 19 is an exemplary side view schematically illustrating a generalconfiguration of a part of a screen printing device comprised in theapparatus for manufacturing the wiring board, in the fifth embodiment;

FIG. 20 is an exemplary front view schematically illustrating a generalconfiguration of a part of an ink jet printing device comprised in theapparatus for manufacturing the wiring board, in the fifth embodiment;

FIG. 21 is an exemplary plan view schematically illustrating a generalconfiguration of an apparatus for manufacturing a wiring board accordingto a sixth embodiment;

FIG. 22 is an exemplary plan view schematically illustrating a generalconfiguration of an apparatus for manufacturing a wiring board accordingto a seventh embodiment;

FIG. 23 is an exemplary front view schematically illustrating a generalconfiguration of a part of an ink jet printing device comprised in theapparatus for manufacturing the wiring board, in the seventh embodiment;

FIG. 24 is an exemplary plan view schematically illustrating a generalconfiguration of an apparatus for manufacturing a wiring board accordingto an eighth embodiment; and

FIG. 25 is an exemplary side view schematically illustrating a generalconfiguration of an ink jet printing device and a pressing device thatare comprised in the apparatus for manufacturing the wiring board, inthe eighth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, an apparatus for manufacturinga flexible printed wiring board, comprises: a device configured topartially provide a second conductor layer on a surface of a firstconductor layer; a device configured to partially provide a firstinsulating layer on the surface of the first conductor layer; a deviceconfigured to integrate the first conductor layer, the second conductorlayer, the first insulating layer, and a third conductor layer, in astate in which the second conductor layer and the first insulating layerprovided on the surface of the first conductor layer are covered withthe third conductor layer from a side opposite the first conductorlayer; a device configured to form a conductor pattern by partiallyremoving at least one of the first conductor layer and the thirdconductor layer in a structure obtained by integrating the firstconductor layer, the second conductor layer, the first insulating layer,and the third conductor layer; and a device configured to cover bothsides of the structure in which the conductor pattern is formed withsecond insulating layers.

In a plurality of embodiments described below, constitutional elementshaving identical functions are comprised. Therefore, hereinafter, theconstitutional elements having identical functions are given samenumerals and their repeated explanation is omitted.

FIG. 1 illustrates a television receiver 181 according to a firstembodiment. The television receiver 181 is one example of “electronicdevice”. The television receiver 181 comprises a body 182 and a stand183 that supports the body 182. The body 182 comprises a casing 184 anda display device 185 housed in the casing 184. The display device 185comprises a display screen 185 a that displays images. The casing 184comprises an opening 184 a that exposes the display screen 185 a.

As illustrated in FIG. 1, the casing 184 houses therein a flexibleprinted wiring board 38. Here, the casing 184 may house the flexibleprinted wiring board 38 according to a second embodiment or a thirdembodiment described below in place of the flexible printed wiring board38 in the present embodiment.

Hereinafter, the flexible printed wiring board 38 is explained indetail.

FIG. 2 to FIG. 6 disclose the flexible printed wiring board 38 accordingto the first embodiment. The flexible printed wiring board 38 haspliability (flexibility) and, for example, it is possible to deform(bend) the flexible printed wiring board 38 by relatively large amounts.Here, “flexible printed wiring board” mentioned in the embodiments isnot limited to a flexible printed wiring board capable of being bent tothe large angle in excess of 90°, and comprises a flexible printedwiring board capable of being bent to the small angle (5° or more, forexample).

FIG. 2 schematically illustrates one example of the configuration of theflexible printed wiring board 38. The flexible printed wiring board 38comprises an insulating layer 102, vias 103, a first conductor pattern104, a second conductor pattern 105, a first coverlay 106, and a secondcoverlay 107.

The insulating layer 102 is, for example, referred to as a base materialor a base film that constitutes a film-like insulator (insulatinglayer). The insulating layer 102 is constituted of an insulationmaterial 111 (see FIG. 3 and FIG. 4) with pliability (flexibility) aftercuring. The insulating layer 102 is formed by curing the insulationmaterial 111 (insulating resin) such as thermosetting resin orthermoplastic resin.

The insulation material 111 according to the present embodiment has, forexample, characteristics (viscosity or hardness) so as to be capable ofbeing applied in the screen printing or the inkjet printing. Theinsulation material 111 is, for example, fusible and can be changed intoa liquid form (ink-like form).

As a specific example of the insulation material 111 in the presentembodiment, any one of elementary substances such as epoxy resin,polyimide resin, polyamide resin, poly-ethylene terephthalate resin,liquid crystal polymer resin, silicon resin, polyurethane resin, andfluorine resin, or a mixture obtained by combining some of theabove-mentioned substances are named. Here, the insulation material 111is not limited to the above-mentioned examples.

As illustrated in FIG. 2, the insulating layer 102 comprises a firstsurface 102 a and a second surface 102 b positioned on a side oppositethe first surface 102 a. In the insulating layer 102, holes 102 c thatextend between the first surface 102 a and the second surface 102 b areprovided. That is, the holes 102 c penetrate between the first surface102 a and the second surface 102 b.

Each of the vias 103 is positioned in the hole 102 c of the insulatinglayer 102. The each of the vias 103 extends between the first surface102 a and the second surface 102 b of the insulating layer 102. Athickness T1 of the via 103 is substantially the same as a thickness T2of the insulating layer 102. The via 103 is, for example, provided bycuring electrically conductive paste 112 (see FIG. 3 and FIG. 4).

The electrically conductive paste 112 is, for example, conductive pasteor soldering paste (solder-based paste). One example of the “conductivepaste” is a mixture obtained by mixing conductive powder with thethermosetting resin (or the thermoplastic resin); for example, copperpaste, silver paste, or a mixture obtained by mixing the copper pastewith the silver paste are named. Furthermore, as the “conductive paste”,nanopaste such as copper nanopaste or silver nanopaste may be used. Oneexample of the “solder paste” is a mixture obtained by mixing fineparticles of solder alloy with flux.

The electrically conductive paste 112 in the present embodiment hascharacteristics (viscosity or hardness) capable of being applied in thescreen printing or the ink jet printing. Here, the electricallyconductive paste 112 is not limited to the above-mentioned examples.

As illustrated in FIG. 2, the first conductor pattern 104 (firstconductor layer) is provided on the first surface 102 a of theinsulating layer 102. The first conductor pattern 104 is connected(joined) to the via 103 and electrically connected to the via 103. Thesecond conductor pattern 105 (second conductor layer) is provided on thesecond surface 102 b of the insulating layer 102. The second conductorpattern 105 is connected (joined) to the via 103 and electricallyconnected to the via 103. That is, the via 103 electrically connects thefirst conductor pattern 104 to the second conductor pattern 105.

Each of the first conductor pattern 104 and the second conductor pattern105 is, for example, a wiring pattern (signal layer). Here, either oneof the first conductor pattern 104 or the second conductor pattern 105may be a solid layer that constitutes a power source layer or a groundlayer.

The flexible printed wiring board 38 is, for example, constituted of aso-called two-layer material that is formed by stacking the firstconductor pattern 104 or the second conductor pattern 105 directly onthe insulating layer 102.

As illustrated in FIG. 2, the first coverlay 106 (first cover layer) isstacked on the first conductor pattern 104, and the second coverlay 107(second cover layer) is stacked on the second conductor pattern 105.Each of the first coverlay 106 and the second coverlay 107 constitutesan insulator (insulating layer) for protection, and is exposed to theoutside of the flexible printed wiring board 38.

As illustrated in FIG. 2, each of the first coverlay 106 and the secondcoverlay 107 comprises, for example: a surface layer 113; and anadhesive layer 114 (adhesive agent) positioned between the surface layer113 and the insulating layer 102. The surface layer 113 is, for example,constituted of an insulation resin such as a polyimide resin or apolyethylene terephthalate resin.

FIG. 3 illustrates a flexible printed wiring board 38 according to asecond embodiment. The flexible printed wiring board 38 in the presentembodiment partially differs in thickness. One example of the flexibleprinted wiring board 38 comprises a first part 131 and a second part 132with a thickness larger than that of the first part 131.

The first part 131 is an area on which parts (electronic components) arenot mounted and the area is given priority to the characteristic ofbeing flexibly deformed (bent). The first part 131 has a configurationsubstantially the same as that of the flexible printed wiring board 38in the above-mentioned first embodiment. That is, the first part 131comprises a first insulating layer 102, the vias 103, the firstconductor pattern 104, the second conductor pattern 105, the firstcoverlay 106, and the second coverlay 107.

The second part 132 is an area on which parts 134 (electroniccomponents) are mounted and the area is hardly deformed (bent) comparedto the first part 131. The second part 132 comprises a second insulatinglayer 135, the first conductor pattern 104, the second conductor pattern105 (not illustrated in the drawings), the first coverlay 106, and thesecond coverlay 107. The second insulating layer 135 is a partcorresponding to the first insulating layer 102 and positioned betweenthe first conductor pattern 104 and the second conductor pattern 105.The second insulating layer 135 is large in thickness compared to thefirst insulating layer 102.

The second insulating layer 135 is formed while changing the thicknessof the insulation material 111 applied compared to the first insulatinglayer 102. The thickness of the insulation material 111 can partiallybe, for example, varied by applying the insulation material 111 in theinkjet printing. Due to such configuration, it is possible to improvethe stability of component mounting and the reliability of the flexibleprinted wiring board 38.

Here, in one example illustrated in FIG. 3, the second part 132comprises no vias 103. However, the embodiment is not limited to thisexample. The second part 132 may comprise the vias 103. Here, in thiscase, the vias 103 of the second part 132 are formed while changing thethickness of the electrically conductive paste 112 applied compared tothe vias 103 of the first part 131.

FIG. 4 illustrates the flexible printed wiring board 38 according to athird embodiment. Here, in FIG. 4, for the sake of convenience in theexplanation made hereinafter, areas of the first conductor patterns 104are hatched. The flexible printed wiring board 38 in the presentembodiment comprises insulating layers constituted of insulationmaterials partially different from each other. As illustrated in FIG. 4,the first conductor pattern 104 (or the second conductor pattern 105)comprises pads 141 and signal lines 142 that connect between the pads141. The signal lines 142 are, for example, lines used for high-speedtransmission (differential wiring, for example).

The flexible printed wiring board 38 in the present embodiment comprisesa first part 143 and a second part 144. The first part 143 is, forexample, an area in which the signal lines 142 are not formed. The firstpart 143 comprises a configuration substantially the same as that of theflexible printed wiring board 38 in the above-mentioned firstembodiment. That is, the first part 143 comprises the first insulatinglayer 102, the vias 103, the first conductor pattern 104, the secondconductor pattern 105, the first coverlay 106, and the second coverlay107.

The second part 144 is an area corresponding to the signal lines 142.That is, the second part 144 is the area in which the signal lines 142are provided. The second part 144 is, for example, the area positioneddirectly below the signal lines 142. The second part 144 comprises asecond insulating layer 146, the first conductor pattern 104, the secondconductor pattern 105, the first coverlay 106, and the second coverlay107. The second insulating layer 146 is a part corresponding to thefirst insulating layer 102 and positioned between the first conductorpattern 104 and the second conductor pattern 105. The second insulatinglayer 146 is constituted of the insulation material 111 different fromthe insulation material of the first insulating layer 102.

Here, in transmitting a signal in the printed wiring board, the higherthe frequency of the signal is, the larger the transmission lossbecomes. Therefore, the transmission performance is degraded along withthe attenuation of the signal. The transmission loss is resulted from asum of a conductor loss generated in a conductor in which the signal istransmitted, a dielectric loss generated by bringing the printed wiringboard into contact with a dielectric body, and a radiation lossgenerated in a flexural portion or an end portion of the wiring or thelike. The dielectric loss is attributed to a dielectric constant, adielectric dissipation factor, or the like. Accordingly, when theprinted wiring board is constituted of a material having a lowdielectric constant and a low dielectric dissipation factor, thetransmission loss is decreased.

However, the material with the low dielectric constant and the lowdielectric dissipation factor is generally expensive. Accordingly, whenthe entire printed wiring board is constituted of the material with thelow dielectric constant and the low dielectric dissipation factor, themanufacturing cost is increased.

Here, the second insulating layer 146 is formed while changing thethickness of the insulation material 111 applied compared to the firstinsulating layer 102. The thickness of the insulation material 111 canpartially be, for example, varied by applying the insulation material111 in the ink jet printing.

To be more specific, as the insulation material 111 of the secondinsulating layer 146, a material with the dielectric constant and thedielectric dissipation factor lower than those of the insulationmaterial 111 of the first insulating layer 102 is used. One example ofthe insulation material 111 of the second insulating layer 146 containsmany fillers. On the other hand, as the insulation material 111 of thefirst insulating layer 102, a common material is used. Due to suchconfiguration, it is possible to suppress the transmission loss whilereducing a cost for manufacturing the flexible printed wiring board 38.

Here, the insulation material 111 containing many fillers has the higherhardness compared to the insulation material 111 containing a fewfillers. Accordingly, as described in the second embodiment, in theflexible printed wiring board 38 comprising the first part 131 that isgiven priority to the flexibility and the second part 132 that is thearea for mounting the parts, the insulation materials 111 of the firstpart 131 and the second part 132 may differ from each other. Forexample, as the insulation material 111 of the first part 131, thecommon material is used. As the insulation material 111 of the secondpart 132, the material containing many fillers compared to theinsulation material 111 of the first part 131 is used. Due to suchconfiguration, it is possible to improve the stability of the componentmounting and the reliability of the flexible printed wiring board 38.

FIG. 5 illustrates an electronic device 151 according to a fourthembodiment. The electronic device 151 is, for example, a notebook-typeportable computer (notebook PC). Here, the electronic device to whichthe present embodiment is applicable is not limited to theabove-mentioned example. The present embodiment is extensivelyapplicable to various types of the electronic device such as atelevision receiver, a tablet terminal, a slate-type portable computer(slate PC), a mobile phone, a smart phone, a digital book terminal, or agame machine.

As illustrated in FIG. 5, the electronic device 151 has a first unit152, a second unit 153, and hinges 154 a and 154 b. The first unit 152is, for example, an electronic device body. The first unit 152 comprisesa first casing 156.

The second unit 153 is, for example, a display module, and comprises asecond casing 157 and a display device 158 housed in the second casing157. The display device 158 is, for example, a liquid crystal display.However, the display device 158 is not limited to the liquid crystaldisplay. The display device 158 comprises a display screen 158 a onwhich images are displayed. The second casing 157 comprises an opening157 a that exposes the display screen 158 a to the outside thereof.

The second casing 157 is connected to the posterior end portion of thefirst casing 156 in a rotatable (openable/closable) manner with the useof the hinge modules 154 a and, 154 b. Due to such a constitution, theelectronic device is configured such that the second unit 153 isrotatable between a first position where the second unit 153 is put onthe first unit 152 and a second position where the second unit 153 isdisposed in an open state relative to the first unit 152.

Next, the configuration inside the first casing 156 (hereinafter,referred to as merely “casing 156”) is explained in detail.

As illustrated in FIG. 6, the casing 156 comprises a first circuit board161, a second circuit board 162, a third circuit board 163, an opticaldisk drive (ODD) 164, and a hard disk drive (HDD) 165.

The first circuit board 161 is, for example, a main board on which acentral processing unit (CPU) 166 is mounted. The second circuit board162 is positioned on an end portion of the casing 156 and comprises afirst connector 167 mounted thereon. The third circuit board 163 ispositioned on another end portion of the casing 156 and comprises asecond connector 168 mounted thereon. The first connector 167 and thesecond connector 168 provide, for example, passages through whichsignals of high-frequency band (gigahertz-frequency band, for example)flow.

The electronic device 151 further comprises the flexible printed wiringboards 38 that electrically connect between the first circuit board 161and each of the second circuit board 162, the third circuit board 163,the ODD 164, and the HDD 165. Each flexible printed wiring board 38corresponds to the flexible printed wiring board in any one of the firstembodiment to the third embodiment, which are described above.

FIG. 7 illustrates the flexible printed wiring board 38 that connectsbetween the ODD 164 and the first circuit board 161. The flexibleprinted wiring board 38 comprises a connector 169 that is mountedthereon and connected to the ODD 164. The connector 169 is one exampleof “electronic component”. The flexible printed wiring board 38 on whichthe electronic component is mounted is one example of “module”.

As illustrated in FIG. 7, the flexible printed wiring board 38comprises, for example, a first part 171 arranged along an insidesurface 156 a of the casing 156 and a second part 172 that is bent withrespect to the first part 171 and spaced apart from the inside surface156 a of the casing 156.

Due to such configuration, the reduction in thickness and weight of theflexible printed wiring board 38 can achieve the reduction in thicknessand weight of the electronic device 151. Furthermore, recently, thereexists tendency that the electronic device 151 reduces the thicknessthereof by miniaturizing the main board (first circuit board 161).Accordingly, the distance between the first circuit board 161 and theconnectors 167, 168 arranged on the side face of the casing 156 isincreased and hence, electrical losses are liable to be generatedtherebetween.

On the other hand, with the constitution of the present embodiment, inthe same manner as the case of the above-mentioned first embodiment, itis possible to use the electrically conductive paste 112 with smallelectric resistivity thus suppressing the electrical losses between thefirst circuit board 161 and the connectors 167, 168. The use of theelectrically conductive paste 112 contributes to the improvement in theperformance of the electronic device 151.

First of all, in conjunction with FIGS. 8 to 10, a method formanufacturing the flexible printed wiring board 38 (see FIG. 16) in afifth embodiment is explained. In the present embodiment, as oneexample, the flexible printed wiring board 38 is manufactured inaccordance with procedures ((processes, acts) S1 to S7) illustrated inFIG. 8.

At S1, as one example, as illustrated in FIGS. 9, 10, conductor layers32 (second conductor layer) are provided on a surface 31 a of aconductor layer 31 (first conductor layer, conductive film). Theconductor layer 31 is, for example, made of copper foil. The conductorlayer 31 is, as illustrated in FIG. 9 as one example, provided in aquadrangle-film shape (rectangular-film shape, for example).

The conductor layer 31 can be, as illustrated in FIGS. 9, 10 as oneexample, stacked on a pallet 51 (work, plate, stacking plate, supportmember, conveyance body, base) and a cushion material 52 (buffermaterial, elastic body). The pallet 51 and the cushion material 52 are,for example, formed wider than the conductor layer 31 in such a mannerthat the pallet 51 and the cushion material 52 are protruded outwardfrom the periphery of the conductor layer 31. The pallet 51 is formed ina quadrangle-plate shape (rectangular-plate shape, for example). Thecushion material 52 is formed in a quadrangle-sheet shape(rectangular-sheet shape, for example). The cushion material 52 isstacked on the pallet 51. The conductor layer 31 is stacked on thepallet 51 via the cushion material 52. The cushion material 52 is softerthan the pallet 51 and has flexibility (pliability, elasticity). At eachstep in manufacturing the flexible printed wiring board 38, theconductor layer 31, and the respective layers and structures that areprovided on the conductor layer 31 can be conveyed while being stackedon the pallet 51 and the cushion material 52, or only on the pallet 51.The pallet 51 functions as the support member that supports theconductor layer 31 being soft and capable of being easily bent, and therespective layers and structures that are formed on the conductor layer31.

At S1, the conductor layer 32 can be, for example, formed by applying aconductor 32L onto the surface 31 a of the conductor layer 31 in a statein which the conductor 32L has fluidity. The conductor 32L is, forexample, selectively (partially) applied onto the surface 31 a of theconductor layer 31. The application of the conductor 32L can beperformed by making use of a printing technique or by applying theprinting technique. The conductor 32L is cured (solidified, dried) at astep after S1 (S4 in the present embodiment, for example). Furthermore,the conductor 32L can be cured locally or restrictively in S1. Theconductor 32L is, for example, made of electrically conducting paste (inthe present embodiment, silver paste, copper paste or the like, forexample).

At S2, as illustrated in FIGS. 11 and 12 as one example, an insulatinglayer 33 (first insulating layer) is provided on the surface 31 a of theconductor layer 31. At S2, the insulating layer 33 is, for example,formed by applying an insulator 33L onto the surface 31 a of theconductor layer 31 in a state in which the insulator 33L has fluidity.The insulator 33L is, for example, selectively (partially) applied ontothe surface 31 a of the conductor layer 31. In this case, the insulator33L is applied onto a part (area) off from a part onto which theconductor 32L is applied (part (area) on which the conductor layer 32 isprovided) so that (the insulator 33L does not contact the conductor 32Land) the insulator 33L is next to the conductor 32L (conductor layer32). The insulator 33L is cured (solidified, dried) in a stage after S1(S4 in the present embodiment, for example). Furthermore, the insulator33L can be cured locally or restrictively at S2. The insulator 33L is,for example, made of a thermosetting synthetic-resin material (polyimideor the like in the present embodiment, for example).

It is possible to perform S1 and S2 concurrently. Furthermore, one of S1and S2 can be performed first, and the other step can be performed next.When S1 is performed prior to S2, the insulating layer 33 is hardlyinterposed into a contact portion (connection portion) between theconductor layer 31 and the conductor layer 32. Furthermore, as oneexample, when S1 is performed prior to S2, due to the deterioration(oxidation or the like, for example) of the surface 31 a of theconductor layer 31, the increase in electric resistance of theconnection portion between the conductor layer 31 and the conductorlayer 32 or the deterioration in bonding strength between the conductorlayer 31 and the conductor layer 32 can easily be suppressed.

Furthermore, at S1 and S2, as one example, as illustrated in FIG. 12, itis possible to form the conductor layer 32 higher than the insulatinglayer 33 in a protruded manner. In this case, at later S4, the conductorlayer 32 and a conductor layer 34 (see FIGS. 13, 14) can securely beelectrically connected with each other. Furthermore, at S1 and S2, asone example, as illustrated in FIG. 11, it is possible to provide a gapg between the conductor 32L (conductor layer 32) and the insulator 33L(insulating layer 33). At later S4, the conductor layer 32 or theinsulating layer 33 that is deformed by being pressed in the thicknessdirection (height direction, vertical direction in FIG. 12) enters thegap g. Furthermore, after S1 and S2, a process such that the conductorlayer 32 or the insulating layer 33 is partially or restrictively cured(solidified, dried) may be performed.

At S3, as one example, as illustrated in FIG. 13, one side of theconductor layer 32 and the insulating layer 33 opposite other sidethereof covered by the conductor layer 31 is covered with the conductorlayer 34 (third conductor layer, conductive film). Furthermore, at S4performed next, as one example, as illustrated in FIG. 14, the conductorlayer 32 and the insulating layer 33 are sandwiched between theconductor layer 31 and the conductor layer 34, and pressed. Here, astructure 35 provided in such away that the conductor layer 32 and theinsulating layer 33 are sandwiched between the conductor layer 31 andthe conductor layer 34 is sandwiched between presses 14 a (and thepallet 51) by way of the cushion materials 52. At S4, as one example,the structure 35 is pressed and heated in a state illustrated in FIG. 14and hence, a structure 40 such that the conductor layers 31, 32, and 34and the insulating layer 33 are integrally formed can be obtained.

Thereafter, at S5, as one example, at least one of the conductor layer31 and the conductor layer 34 is partially removed thus formingconductor patterns 36 as illustrated in FIG. 15. At S6 performed next,as one example, the following post processing is performed. That is, forexample, processing in which an insulating layer 37 (outer layer, seeFIG. 17) with which the conductor layers 31 and 34 are covered isprovided, processing in which a reinforcing member (reinforcing platenot illustrated) is provided, and processing in which the surfacetreatment (application of preflux, plating treatment or the like, forexample) for the conductor layer 31 or the conductor layer 34 isperformed. Furthermore, at S7, a machining process such as cutting is,for example, performed and hence, as one example, the flexible printedwiring board 38 (wiring board) as illustrated in FIGS. 16, 17 can beobtained. Here, in FIGS. 8 to 10, the comparatively simple constitutionof the flexible printed wiring board 38 is illustrated. However, it isneedless to say that the flexible printed wiring board 38 having morecomplicated constitution can be manufactured by the above-mentionedmanufacturing method.

By the above-mentioned manufacturing method, in a so-called both-sidedboard having conductor patterns 36 provided on both sides thereof, it ispossible to provide the insulating layer 33, which is to be the baselayer (inner layer), on the conductor layer 31 by applying the insulator33L in a state in which the insulator 33L has fluidity. Therefore, asone example, the control of application of the insulator 33L allows tochange the characteristics such as constituents or thicknesses of theinsulating layer 33 depending on the place (position) on the conductorlayer 31. Accordingly, as one example, the flexible printed wiring board38 (wiring board) with less inconvenience can easily be obtained.Furthermore, as one example, the characteristics of the insulating layer33 (base layer) can easily be varied.

In the present embodiment, as one example, FIG. 18 illustrates amanufacturing apparatus 1A (an apparatus for manufacturing a flexibleprinted wiring board 38, an apparatus for manufacturing a wiring board),and FIG. 8 illustrates the above-mentioned flow. It is possible tomanufacture the flexible printed wiring board 38 with the use of themanufacturing apparatus 1A in accordance with the above-mentioned flow.The manufacturing apparatus 1A (apparatus, facility, or system formanufacturing the flexible printed wiring board 38) comprises aplurality of sections 11 to 18 (in the present embodiment, as oneexample, eight (8) sections, devices, stages, units, modules, orfacilities). To be more specific, for example, in the first section 11,the processing of S1 in FIG. 8 is performed. In the second section 12,the processing of S2 in FIG. 8 is performed. In the third section 13,the processing of S3 in FIG. 8 is performed. In the fourth section 14,the processing of S4 in FIG. 8 is performed. In the fifth section 15,the processing of S5 in FIG. 8 is performed. In the sixth section 16,the processing of forming the reinforcing member, the insulating layer37 (outer layer) or the like out of the processing of S6 in FIG. 8 isperformed. In a seventh section, the surface treatment for exposedportions on the conductor layers 31, 32, and 34 out of the processing ofS6 in FIG. 8 is performed. Furthermore, in the eighth section 18, theprocessing of S7 in FIG. 8 is performed. Furthermore, the manufacturingapparatus 1A comprises a conveyance device 19 for conveying palletsamong the sections 11 to 18. Here, categories, layouts (position,direction, order or the like), sizes (width, height, or the like) or thelike of the sections 11 to 18 illustrated in FIG. 18 merely constituteone example, and modifications for the manufacturing apparatus 1A arearbitrarily conceivable.

In the present embodiment, as one example, in the first section 11, ascreen printing device 11A (application device, film forming device) isprovided. The screen printing device 11A comprises, for example, ascreen 11 a, a nozzle 11 b (discharging portion, dispenser), a blade 11c (spatula), a moving device 11 d (transfer mechanism), and the like.The nozzle 11 b and the blade 11 c are attached to a slider 11 e of themoving device 11 d. The slider 11 e can reciprocate along a rail 11 f ofthe moving device 11 d in parallel with the surface 31 a of theconductor layer 31. Furthermore, the slider 11 e is movable between aposition close to the surface 31 a (position illustrated in FIG. 19) anda position distant from the surface 31 a. The screen 11 a is providedalong the surface 31 a at a position spaced apart from the surface 31 a.However, the screen 11 a is pressed by the blade 11 c thus being broughtinto contact with the surface 31 a. The nozzle 11 b discharges a mediumwith fluidity (conductor 32L or the like, ink) to a screen surface sideopposite the surface 31 a on the screen 11 a. The distal end portion(edge portion, end portion, peripheral portion) of the blade 11 c can bemoved by the moving device 11 d along the surface 31 a and the screen 11a (in the lateral direction in the example in FIG. 19) while pressingthe screen 11 a to the surface 31 a. That is, the blade 11 c (distal endportion thereof) can rub the medium discharged to a screen surface sideopposite the surface 31 a on the screen 11 a. The screen 11 a comprisesholes 11 g formed therein through which the medium passes. In suchconfiguration, the nozzle 11 b discharges the medium onto the screen 11a while being moved by the moving device 11 d. The distal end portion ofthe blade 11 c is moved by the moving device 11 d along the surface 31 awhile pressing the screen 11 a to which the medium is discharged to thesurface 31 a. Due to such configuration, the ink is applied to thesurface 31 a passing through the holes 11 g of the screen 11 a. Thescreen printing device 11A applies the medium (conductor 32L or thelike, ink) to the surface 31 a in the pattern corresponding to the holes11 g pattern (position, size, layout, or the like).

In the present embodiment, as one example, in the second section 12, anink jet printing device 12A (application device, film forming device)illustrated in FIG. 20 is installed. The ink jet printing device 12Acomprises, for example, a head 12 a (discharging portion, injectingportion), a moving device 12 b (transfer mechanism), a conveyance device12 c, and the like. The head 12 a is attached to a slider 12 d of themoving device 12 b. The slider 12 d can be moved along a rail 12 e ofthe moving device 12 b in parallel with the surface 31 a of theconductor layer 31. The head 12 a discharges (injects) the medium at atiming controlled by a controller (not illustrated in the drawings)while being moved by the moving device 12 b. Furthermore, the conductorlayer 31 is conveyed by the conveyance device 12 c (conveyance roller 12c 4 or the like, for example) in a state that the conductor layer 31 isstacked on the pallet 51. The direction of moving the head 12 a in themoving device 12 b intersects with (“is orthogonal to” in the presentembodiment, for example) the direction of moving the conductor layer 31on the conveyance device 12 c. The controller controls a timing at whichthe medium is discharged from the head 12 a and operations of the movingdevice 12 b and the conveyance device 12 c so that a predeterminedpattern of the medium is formed on the surface 31 a. In this manner, theink jet printing device 12A applies the medium (insulator 33L or thelike, ink) to the surface 31 a in the predetermined pattern.

In the present embodiment, as one example, in the third section 13, aplacing device 13A (see FIG. 18) is installed. The placing device 13Acomprises, for example, a stage (placement portion not illustrated) onwhich the pallet 51 is placed, a conveying device (loading device notillustrated) that conveys an object to be placed, or the like. In theplacing device 13A, the conductor layer 34 is placed on the conductorlayer 31 on which the conductor layer 32 and the insulating layer 33 areprovided. Due to such configuration, as illustrated in FIG. 13, theconductor layer 32 and the insulating layer 33 are covered with theconductor layer 34 from the surface sides thereof opposite the conductorlayer 31. That is, the conductor layer 32 and the insulating layer 33are sandwiched between the conductor layer 31 and the conductor layer34. An object to be placed on the conductor layer 32 and the insulatinglayer 33 (conductor layer 34, for example) can be placed by theconveying device or by an operator's manual operation.

In the present embodiment, as one example, in the fourth section 14, apressing device 14A (press machine, see FIG. 14) is provided. Thepressing device 14A comprises, for example, the press 14 a, heaters 14 b(heating portions), or the like. The press 14 a comprises a pair of(parallel) surfaces 14 c that face to each other. The structure 35 thatis placed on the pallet 51 and the cushion material 52 is sandwichedbetween the surfaces 14 c of the press 14 a in a state that thestructure 35 is covered with the cushion materials 52. That is, thestructure 35 is sandwiched by the press 14 a by way of the cushionmaterials 52. The press 14 a comprises the heaters 14 b. Due to suchconfiguration, the pressing device 14A pressurizes (presses) thestructure 35 by the press 14 a while heating the structure 35 by theheaters 14 b. In such a manner, the structure 40 such that the conductorlayers 31, 32, and 34 and the insulating layer 33 are integrally formedcan be obtained. Here, in the pressing device 14A, as one example, aplurality of structures 40 can be obtained by pressurizing a pluralityof structures 35 stacked. Furthermore, in the pressing device 14A, asone example, the thickness of the cushion material 52 is varieddepending on a position at which the structure 35 is placed, thuschanging the thickness of the structure 40. That is, the thickness ofthe structure 40 sandwiched between the cushion materials 52 havinglarge thicknesses is reduced (the structure 40 is reduced in height),and the thickness of the structure 40 sandwiched between the cushionmaterials 52 having small thicknesses is increased (the structure 40 isincreased in height). When the structure 35 is pressurized by thepressing device 14A (S4), the conductor layers 31 and 34 are higher inhardness than the conductor layer 32 (conductor 32L) and the insulatinglayer 33 (insulator 33L) and hence, the thickness of the conductor layer32 or the insulating layer 33 can locally be varied.

In the present embodiment, as one example, in the fifth section 15,there is provided a conductor pattern forming device 15A that providesthe conductor pattern 36 on the structure 40 obtained in the fourthsection 14 by performing, for example, mask etching or the like.Furthermore, as one example, in the sixth section 16, there is providedan outer layer forming device 16A that provides the insulating layer 37(outer layer, third insulating layer, see FIGS. 16, 17), the reinforcingmember, or the like on both sides of a structure on which the conductorpattern 36 is formed by bonding, for example, with an adhesive 39 in thefifth section 15. Furthermore, as one example, in the seventh section17, there is provided a surface treatment device 17A that applies asurface treatment to the exposed conductor portions of a structure onwhich the insulating layer 37, the reinforcing member, or the like isformed in the sixth section 16. Furthermore, as one example, in theeighth section 18, there is provided an outline machining device 18Athat machines a structure to which the surface treatment is applied inthe seventh section 17 to obtain the flexible printed wiring board 38.

Furthermore, in the present embodiment, as one example, there is aconveyance device 19 comprising a rail 19 a, a slider 19 b, a rotationalsupport 19 c, an arm 19 d, and a support 19 e. In the manufacturingapparatus 1A according to the present embodiment, as one example, a rowof the first section 11 to the fourth section 14 and a row of the fifthsection 15 to the eighth section 18 are collaterally provided (inparallel with each other, as one example in the present embodiment) in aspaced-apart manner. The conveyance device 19 is positioned between therows (spaced apart from the rows). The rail 19 a is extended in parallelwith the row of the first section 11 to the fourth section 14 and therow of the fifth section 15 to the eighth section 18, and along therows. The slider 19 b is moved along the rail 19 a. The rotationalsupport 19 c supports the arm 19 d and the support 19 e in a rotatablemanner relative to the slider 19 b. The arm 19 d moves the support 19 ebetween a position inside of each of the sections 11 to 18 and aposition on the rail 19 a side outside each of the sections 11 to 18.The support 19 e supports the pallet 51. Due to such configuration, theconveyance device 19 can transfer (moves) the pallet 51 (and thein-process or finished structure placed on the pallet 51) between therespective sections 11 to 18.

According to the present embodiment described above, as one example, theconductor 32L and the insulator 33L are applied (printed) to theconductor layer 31 in a state in which the conductor 32L and theinsulator 33L have fluidity and hence, the conductor layer 32 and theinsulating layer 33 can be provided on the conductor layer 31.Consequently, according to the present embodiment, as one example, thecharacteristics of the conductor layer 32 and the insulating layer 33are easily adjusted. To be more specific, the conductor layer 32 and theinsulating layer 33 can easily be varied in size (thickness, height,volume, or the like, for example) depending on the position in theflexible printed wiring board 38, and the conductor layer 32 and theinsulating layer 33 can easily be varied in physical property (hardness,modulus of elasticity, electrical conductivity, or the like, forexample) depending on the position in the flexible printed wiring board38. The conductor layer 32 and the insulating layer 33 can have, forexample, varied thicknesses (heights) by applying the conductor 32L andthe insulator 33L a plurality of times to the surface 31 a of theconductor layer 31. That is, the size of the conductor layer 32 or theinsulating layer 33 in the portion (area) to which the conductor 32L orthe insulator 33L is applied a plurality of times or applied many timesis larger than that of the conductor layer 32 or the insulating layer 33in the portion (area) to which the conductor 32L or the insulator 33L isapplied only one time or applied a few times. Here, the conductor layer32 and the insulating layer 33 are applied to the conductor layer 31and, thereafter, are heated or dried by a heater or a dryer, which isnot illustrated in the drawings, thus being solidified partially orrestrictively. Furthermore, the conductor layer 32 or the insulatinglayer 33 can have, for example, varied thicknesses (heights) bycontrolling a discharge rate or a injection quantity (flow rate) of theconductor 32L or the insulator 33L with fluidity from the nozzle 11 b orthe head 12 a. Furthermore, the conductor layer 32 or the insulatinglayer 33 can be, for example, varied in physical property by using thenozzles 11 b or the heads 12 a.

Furthermore, as described above, the insulating layer 33 has a locallyvaried thickness (height) thus providing, for example, a portion (area)thinner than the other portion (area) locally in the insulating layer33. The thin portion of the insulating layer 33 is bent easier than theother portion thereof. Therefore, as one example, the insulating layer33 can be provided thinly at the portion to be bent in the flexibleprinted wiring board 38. Furthermore, as described above, the insulatinglayer 33 has a locally varied thickness (height) thus providing, forexample, a portion (area) thicker than the other portion (area) locallyin the insulating layer 33. The thick portion of the insulating layer 33is hardly bent compared to the other portion thereof. Therefore, as oneexample, in the flexible printed wiring board 38 having a portionconnected to a connector (not illustrated in the drawings), a portionhaving a terminal mounted thereon, or the like that requires higherrigidity or strength, the insulating layer 33 can be formed thick at theportion described above. Accordingly, as one example, there may also bea case that the reinforcing member can be omitted.

Furthermore, in the present embodiment, as one example, the insulator33L with higher insulation property (lower dielectric constant anddielectric dissipation factor) can be used for (applied to) portions(areas) of the insulating layer 33 that are overlapped with theconductor patterns 36 of the conductor layers 31 and 34, and theinsulator 33L with lower insulation property (higher dielectric constantand dielectric dissipation factor) can be used for (applied to) aportion of the insulating layer 33 that is not overlapped with theconductor patterns 36 of the conductor layers 31 and 34. Due to suchconfiguration, as one example, it is possible to obtain the flexibleprinted wiring board 38 such that the conductor patterns 36 of theconductor layers 31 and 34 are locally covered (paved) with theinsulating layer 33 having higher insulation property. The insulator 33Lcan be varied in insulation property depending on the component (contentof filler, for example) of the insulator 33L. There exists the case thatthe insulating layer 33 with high insulation property has hardnesshigher than that of the insulating layer 33 with low insulationproperty. In this case, the above-mentioned constitution facilitatesboth of improvement of signal transmission characteristics in theconductor pattern 36 of the flexible printed wiring board 38 andimprovement of flexibility of the flexible printed wiring board 38.

Furthermore, in the present embodiment, as one example, the insulator33L with higher insulation property (lower dielectric constant anddielectric dissipation factor) can be used for (applied to) portions(areas) of the insulating layer 33 that require higher heat dissipationcharacteristics (heat conduction characteristics), and the insulator 33Lwith lower insulation property (higher dielectric constant anddielectric dissipation factor) can be used for (applied to) the otherportion (area) of the insulating layer 33. Due to such configuration, asone example, it is possible to obtain the flexible printed wiring board38 comprising the insulating layer 33 with high heat dissipatingportions (areas) locally.

Here, as one example, the present embodiment exemplifies the case of theflexible printed wiring board 38 with the conductor patterns 36 providedon both surfaces thereof (so-called both-sided board). However, also ina case in which the flexible printed wiring board not illustrated isprovided with the conductor pattern 36 on one surface of the flexibleprinted wiring board, it is possible to obtain the same advantageouseffects as that of the above-mentioned configuration of the insulatinglayer 33. Furthermore, in the present embodiment, as one example, themanufacturing apparatus 1A can manufacture further multilayered flexibleprinted wiring board (not illustrated) and manufacture a rigid board(printed wiring board, circuit board). Furthermore, in the manufacturingapparatus 1A, in addition to the above-mentioned sections 11 to 18, asection (not illustrated in the drawings) for locally or restrictivelycuring the conductor 32L or the insulator 33L with fluidity that isapplied to the conductor layer 31 can be installed. In this case, thesection for curing is, for example, constituted as a chamber having aheated high-temperature atmosphere.

In a sixth embodiment also, in the same manner as the above-mentionedfifth embodiment, the flexible printed wiring board 38 (wiring board) ismanufactured in accordance with the procedures in the flowchartillustrated in FIG. 8. However, in the present embodiment, as oneexample, as illustrated in FIG. 21, the configuration of a manufacturingapparatus 1B differs from that of the manufacturing apparatus 1A in theabove-mentioned fifth embodiment. To be more specific, as illustrated inFIG. 21, in the first section 11, an ink jet printing device 11B(application device, film forming device) is provided. The constitutionof the ink jet printing device 11B is substantially same as that of theink jet printing device 12A (see FIG. 20) installed in the secondsection 12 of the manufacturing apparatus 1A in the fifth embodiment.Accordingly, in the present embodiment, detailed explanation of the inkjet printing device 11B is omitted.

The manufacturing apparatus 1B in the present embodiment issubstantially same as the manufacturing apparatus 1A except for theconfiguration that the ink jet printing device 11B is provided in placeof the screen printing device 11A in the first section 11. Accordingly,in the manufacturing apparatus 1B in the present embodiment also, it ispossible to provide the conductor layer 32 and the insulating layer 33by applying (printing) the conductor 32L and the insulator 33L to theconductor layer 31. Accordingly, in the present embodiment also, in thesame manner as the above-mentioned fifth embodiment, as one example, thecharacteristics of the conductor layer 32 and the insulating layer 33are easily adjusted. To be more specific, the conductor layer 32 and theinsulating layer 33 can easily be varied in size (thickness, height,volume, or the like, for example) depending on the position in theflexible printed wiring board 38, and the conductor layer 32 and theinsulating layer 33 can easily be varied in physical property (hardness,modulus of elasticity, electrical conductivity, or the like, forexample) depending on the position in the flexible printed wiring board38.

In a seventh embodiment also, in the same manner as the above-mentionedfifth and sixth embodiments, the flexible printed wiring board 38(wiring board) is manufactured in accordance with the procedures in theflowchart illustrated in FIG. 8. However, in the present embodiment, asone example, as illustrated in FIG. 22, the configuration of amanufacturing apparatus 1C differs from that of the manufacturingapparatus 1A in the above-mentioned fifth embodiment and themanufacturing apparatus 1B in the above-mentioned sixth embodiment. Tobe more specific, as illustrated in FIG. 22, the first section 11 isintegrated with the second section 12 and, in the integrated firstsection 11, an ink jet printing device 11C (application device, filmforming device) is provided. The ink jet printing device 11C comprises,as one example, as illustrated in FIG. 23, the head 12 a (dischargingportion, injecting portion), the moving device 12 b (transfermechanism), the conveyance device 12 c, and the like. However, in thepresent embodiment, the head 12 a of the ink jet printing device 11Ccomprises a head 12 a 1 (first application module) that applies theconductor 32L in a state in which the conductor 32L has fluidity and ahead 12 a 2 (second application module) that applies the insulator 33Lin a state in which the insulator 33L has fluidity. Furthermore, themanufacturing apparatus 1C operates the moving device 12 b or theconveyance device 12 c to change the relative position of the head 12 aand the conductor layer 31 and, at the same time, the conductor 32L andthe insulator 33L with fluidity are applied (injected, printed) to thesurface 31 a of the conductor layer 31 using the head 12 a 1 and thehead 12 a 2 thus forming the conductor layer 32 and the insulating layer33.

In the manufacturing apparatus 1C according to the present embodimentalso, it is possible to provide the conductor layer 32 and theinsulating layer 33 by applying the conductor 32L and the insulator 33Lto the conductor layer 31. Accordingly, in the present embodiment also,in the same manner as the above-mentioned fifth and sixth embodiments,as one example, the characteristics of the conductor layer 32 and theinsulating layer 33 are easily adjusted. To be more specific, theconductor layer 32 and the insulating layer 33 can easily be varied insize (thickness, height, volume, or the like, for example) depending onthe position in the flexible printed wiring board 38, and the conductorlayer 32 and the insulating layer 33 can easily be varied in physicalproperty (hardness, modulus of elasticity, electrical conductivity, orthe like, for example) depending on the position in the flexible printedwiring board 38. Furthermore, according to the present embodiment, theconductor layer 32 and the insulating layer 33 can simultaneously beprovided. Consequently, according to the present embodiment, as oneexample, the time required to manufacture the flexible printed wiringboard 38 is reduced easier compared to the case that the conductor layer32 and the insulating layer 33 are separately provided.

Furthermore, in the manufacturing apparatus 1C according to the presentembodiment, as one example, different media (the conductors 32L and theinsulators 33L differing from each other in characteristics, physicalproperties, constituent, or the like) can be applied from each of aplurality of heads 12 a (12 a 1 to 12 a 4). Accordingly, in themanufacturing apparatus 1C according to the present embodiment, as oneexample, the conductor layer 32 or the insulating layer 33 withcharacteristics, physical properties, constituents, or the like locallydifferent from each other can be provided, and the conductor layers 32or the insulating layer 33 with characteristics, physical properties,constituents, or the like different from each other can be provided.Accordingly, the flexible printed wiring board 38 with higherperformance can be obtained easier.

In an eight embodiment also, in the same manner as the above-mentionedfirst to seventh embodiments, the flexible printed wiring board 38(wiring board) is manufactured in accordance with the procedures in theflowchart illustrated in FIG. 8. However, in the present embodiment, asone example, as illustrated in FIG. 24, the configuration of amanufacturing apparatus 1D differs from that of the manufacturingapparatus 1A, 1B, or 1C in the above-mentioned first to seventhembodiments. To be more specific, as illustrated in FIG. 24, the firstsection 11 is integrated with the second to fourth sections 12 to 14and, in the integrated first section 11, an ink jet printing device 11D(application device, film forming device) and a pressing device 14D(press machine) is installed. The ink jet printing device 11D and thepressing device 14D have, as one example, as illustrated in FIG. 25, thehead 12 a (discharging portion, injecting portion), the moving device 12b (transfer mechanism), the conveyance device 12 c, and the like. Thepressing device 14D comprises a pair of pressing rollers 14 d. Theconveyance device 12 c comprises feed rollers 12 c 1 and 12 c 2 (feedingportion), a winding roller 12 c 3 (winding portion, collecting module),the conveyance rollers 12 c 4 (carrying portion, guide portion). Thefeed rollers 12 c 1 and 12 c 2 respectively have strip-shaped bodies 41a and 41 b wound therearound. The strip-shaped bodies 41 a and 41 b arerespectively fed (pulled out) from the feed rollers 12 c 1 and 12 c 2,moved while being guided by the carrying rollers 12 c 4, overlapped inthe middle of the conveyance device 12 c, and sandwiched between a pairof the pressing rollers 14 d arranged collaterally (in parallel witheach other) so as to be pressed. Thereafter, the strip-shaped bodies 41a and 41 b are wound around (collected on) the winding roller 12 c 3.The conductor layer 31 is placed on the strip-shaped body 41 a fed fromthe feed roller 12 c 1 by way of the cushion material 52. The conductorlayer 32 and the insulating layer 33 are provided on the conductor layer31 with the use of the ink jet printing device 11D. The strip-shapedbody 41 a and the strip-shaped body 41 b are overlapped with each otheron the downstream side of the ink jet printing device 11D. The conductorlayer 34 (see FIG. 13) is placed on the side closer to the conductorlayer 32 and the insulating layer 33 of the strip-shaped body 41 b thatis brought into overlap with the conductor layer 32 and the insulatinglayer 33. Accordingly, the strip-shaped bodies 41 a and 41 b areoverlapped with each other on the downstream side of the ink jetprinting device 11D thus obtaining the structure 35 (layered body,internal structure, see FIG. 13) such that the conductor layer 32 andthe insulating layer 33 are sandwiched between the conductor layer 31and the conductor layer 34. A number of he structures 35 are alignedalong the strip-shaped bodies 41 a and 41 b while being sandwichedbetween the strip-shaped bodies 41 a and 41 b and sequentially pressedby a pair of the pressing rollers 14 d. The structures 35 are woundaround the winding roller 12 c 3 and also pressed in the diameterdirection (in the overlapping direction) of the winding roller 12 c 3while being sandwiched between the strip-shaped bodies 41 a and 41 b onthe winding roller 12 c 3. Each structure 35 is pressed in the pressingrollers 14 d and the winding roller 12 c 3 thus obtaining the structure40 (see FIG. 14) such that the conductor layers 31, 32, and 34 and theinsulating layer 33 are integrally formed. Furthermore, in the pressingrollers 14 d or the winding roller 12 c 3, a heater 42 for curing theinsulating layer 33 is installed as required. The heater 42 can be, forexample, constituted as a hot air blower.

Furthermore, in the present embodiment also, the ink jet printing device11D comprises the head 12 a comprising the head 12 a 1 that applies theconductor 32L in a state in which the conductor 32L has fluidity and thehead 12 a 2 that applies the insulator 33L in a state in which theinsulator has fluidity (see FIG. 23). Furthermore, the manufacturingapparatus 1D operates the moving device 12 b or the conveyance device 12c to change the relative position of the head 12 a and the conductorlayer 31 and, at the same time, applies (injected, printed) theconductor 32L and the insulator 33L to the surface 31 a of the conductorlayer 31 from the head 12 a 1 and the head 12 a 2 in a state in whichthe conductor 32L and the insulator 33L has fluidity, thus providing theconductor layer 32 and the insulating layer 33.

In the manufacturing apparatus 1D according to the present embodimentalso, it is possible to provide the conductor layer 32 and theinsulating layer 33 by applying (printing) the conductor 32L and theinsulator 33L to the conductor layer 31. Accordingly, in the presentembodiment also, in the same manner as the above-mentioned first toseventh embodiments, as one example, the characteristics of theconductor layer 32 and the insulating layer 33 are easily adjusted. Tobe more specific, the conductor layer 32 and the insulating layer 33 caneasily be varied in size (thickness, height, volume, or the like, forexample) depending on the position in the flexible printed wiring board38, and the conductor layer 32 and the insulating layer 33 can easily bevaried in physical property (hardness, modulus of elasticity, electricalconductivity, or the like, for example) depending on the position in theflexible printed wiring board 38. Furthermore, in the presentembodiment, the conductor layer 32 and the insulating layer 33 cansimultaneously be provided. Furthermore, according to the presentembodiment, the processing of S11 to S14 can be performed as a series ofprocesses in the integrated first section 11 by making use of thestrip-shaped bodies 41 a and 41 b. Accordingly, in the presentembodiment, as one example, the time required to manufacture theflexible printed wiring board 38 is reduced easier.

Although the embodiments are explained heretofore, each of theabove-mentioned embodiments merely constitutes one example, and variousmodifications are arbitrarily conceivable. For example, the number ofthe sections or the devices can further be increased and also decreased.Furthermore, the specifications (structure, direction, shape, size,length, width, thickness, height, number, arrangement, position,material, or the like) of the devices, the first application module, thesecond application module, the strip-shaped body, the pallet, theconveying device, the conductor layer, the insulating layer, theflexible printed wiring board, the wiring board, the application device,or the like can optionally be changed to achieve the object of theembodiments.

Moreover, the various modules of the systems described herein can beimplemented as software applications, hardware and/or software modules,or components on one or more computers, such as servers. While thevarious modules are illustrated separately, they may share some or allof the same underlying logic or code.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A method for manufacturing a flexible printedwiring board, the method comprising: selectively providing a secondconductor layer on a surface of a first conductor layer by selectivelyapplying an electrically conductive paste onto the surface of the firstconductor layer with use of screen printing or ink jet printing;selectively providing a first insulating layer on the surface of thefirst conductor layer by selectively applying an insulating resin ontothe surface of the first conductor layer with use of screen printing orink jet printing; integrating the first conductor layer, the secondconductor layer, the first insulating layer, and a third conductorlayer, in a state in which the second conductor layer and the firstinsulating layer provided on the surface of the first conductor layerare covered with the third conductor layer from a side opposite thefirst conductor layer by pressing and heating in a state in which thesecond conductor layer and the first insulating layer provided on thesurface of the first conductor layer are covered with the thirdconductor layer from the side opposite the first conductor layer and inwhich the first conductor layer and the third conductor layer aresandwiched between presses; forming a conductor pattern by selectivelyremoving at least one of the first conductor layer and the thirdconductor layer in a structure obtained by integrating the firstconductor layer, the second conductor layer, the first insulating layer,and the third conductor layer; and covering both sides of the structurein which the conductor pattern is formed with second insulating layers,wherein before the integrating the first conductor layer, the secondconductor layer, the first insulating layer, and the third conductorlayer, the height of the second conductor layer becomes higher than theheight of the first insulating layer, and before the integrating thefirst conductor layer, the second conductor layer, the first insulatinglayer, and a third conductor layer, a gap is provided between the secondconductor layer and the first insulating layer.
 2. The method of claim1, wherein the selectively providing of the second conductor layerincludes selectively applying the electrically conductive paste to thesurface of the first conductor layer in a state in which theelectrically conductive paste has fluidity, the selectively providing ofthe first insulating layer includes selectively applying the insulatingresin to the surface of the first conductor layer in a state in whichthe insulating resin has fluidity, and the applying of the electricallyconductive paste and the applying of the insulating resin are performedsimultaneously.
 3. The method of claim 1, wherein the providing of thesecond conductor layer is performed before the providing of the firstinsulating layer.
 4. The method of claim 1, wherein the integratingincludes providing the structure on a strip-shaped body.
 5. The methodof claim 1, wherein the providing of the second conductor layer includesproviding a plurality of the second conductor layers with physicalproperties different from each other on the surface.
 6. The method ofclaim 1, wherein the providing of the first insulating layer includesproviding a plurality of the first insulating layers with physicalproperties different from each other on the surface.
 7. The method ofclaim 1, wherein the providing of the first insulating layer includesproviding a plurality of the first insulating layers with heightsdifferent from each other.
 8. The method of claim 1, comprisingsandwiching and pressing the structure in a thickness direction of thestructure, wherein before the pressing, the structure has differentthicknesses depending on a position of the structure.
 9. An apparatusfor manufacturing a flexible printed wiring board, the apparatuscomprising: a device configured to selectively provide a secondconductor layer on a surface of a first conductor layer by selectivelyapplying an electrically conductive paste onto the surface of the firstconductor layer by screen printing or ink jet printing; a deviceconfigured to selectively provide a first insulating layer on thesurface of the first conductor layer by selectively applying aninsulating resin onto the surface of the first conductor layer by screenprinting or ink jet printing; a device configured to integrate the firstconductor layer, the second conductor layer, the first insulating layer,and a third conductor layer, in a state in which the second conductorlayer and the first insulating layer provided on the surface of thefirst conductor layer are covered with the third conductor layer fromaside opposite the first conductor layer by pressing and heating in astate in which the second conductor layer and the first insulating layerprovided on the surface of the first conductor layer are covered withthe third conductor layer from the side opposite the first conductorlayer and in which the first conductor layer and the third conductorlayer are sandwiched between presses; a device configured to form aconductor pattern by selectively removing at least one of the firstconductor layer and the third conductor layer in a structure obtained byintegrating the first conductor layer, the second conductor layer, thefirst insulating layer, and the third conductor layer; a deviceconfigured to cover both sides of the structure in which the conductorpattern is formed with second insulating layers; and a device configuredto sandwich the structure in a thickness direction of the structure viacushion materials and press the structure in the thickness direction,wherein the device configured to press the structure sandwiches thestructure to different thicknesses depending on a position in thestructure, by varying a thickness of the cushion materials at differentpositions in the cushion materials.
 10. The apparatus for manufacturinga flexible printed wiring board of claim 9, wherein the deviceconfigured to selectively provide the second conductor layer comprises afirst ink jet printing device configured to apply the electricallyconductive paste to the surface of the first conductor layer byselectively applying the electrically conductive paste to the surface ofthe first conductor layer in a state in which the electricallyconductive paste has fluidity, the device configured to selectivelyprovide the first insulating layer comprises a second ink jet printingdevice configured to apply the insulating resin to the surface of thefirst conductor layer by selectively applying the insulating resin tothe surface of the first conductor layer in a state in which theinsulating resin has fluidity, and the first ink jet printing device andthe second ink jet printing device simultaneously apply the electricallyconductive paste and the insulating resin, respectively, onto thesurface of the first conductor layer.
 11. The apparatus formanufacturing a flexible printed wiring board of claim 9, wherein thedevice configured to provide the second conductor layer provides thesecond conductor layer on the surface before the device configured toprovide the first insulating layer provides the first insulating layeron the surface.
 12. The apparatus for manufacturing a flexible printedwiring board of claim 9, wherein the device configured to integrate thefirst conductor layer, the second conductor layer, the first insulatinglayer, and the third conductor layer provides the structure on astrip-shaped body.
 13. The apparatus for manufacturing a flexibleprinted wiring board of claim 9, further comprising a conveying deviceconfigured to convey a pallet between the devices, the first conductorlayer being placed on the pallet.
 14. The apparatus for manufacturing aflexible printed wiring board of claim 9, wherein the device configuredto provide the second conductor layer provides a plurality of the secondconductor layers with physical properties different from each other onthe surface.
 15. The apparatus for manufacturing a flexible printedwiring board of claim 9, wherein the device configured to provide thefirst insulating layer provides a plurality of the first insulatinglayers with physical properties different from each other on thesurface.
 16. The apparatus for manufacturing a flexible printed wiringboard of claim 9, wherein the device configured to provide the firstinsulating layer provides a plurality of the first insulating layerswith heights different from each other on the surface.